Viscosity, melting point, and DEG content can be adjusted according to customer requirements.
4. Physical & Chemical Properties
State: Solid chips at room temperature
Material Type: Low-melting-point modified copolyester resin
Key Features: Low melting point (115°C), high DEG content, adjustable viscosity and melting point, suitable for bonding and low-temperature processing applications
5. Applications
Low-temperature bonding and laminating applications
Nonwoven and textile bonding fibers
Hot-melt adhesive fibers and filaments
Composite materials requiring low melting point
6. Packaging & Storage
Packaging: 1000kg bags Storage Conditions: Store in a cool, dry, well-ventilated area. Protect from moisture, direct sunlight, and incompatible materials.Handling Precautions: Avoid dust inhalation. Use appropriate personal protective equipment (gloves, goggles) when handling.